发明名称 |
Light-emitting semiconductor device, mounted substrate, and fabrication method thereof |
摘要 |
A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector. |
申请公布号 |
US8319242(B2) |
申请公布日期 |
2012.11.27 |
申请号 |
US201113179200 |
申请日期 |
2011.07.08 |
申请人 |
SHIOBARA TOSHIO;KASHIWAGI TSUTOMU;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SHIOBARA TOSHIO;KASHIWAGI TSUTOMU |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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