发明名称 |
Multi-level circuit substrate fabrication method |
摘要 |
A method of making a semiconductor package substrate includes laser-ablating channels in the substrate. After the channels are ablated in the substrate, conductive material is added to fill the channels and cover the surface of the substrate. Then a photomask etching process simultaneously forms a circuit pattern above the surface of the substrate and removes excess metal above the channels, by removing metal above the surface only in patterned regions. The result is a two-level circuit pattern having conductors within and above the substrate.
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申请公布号 |
US8316536(B1) |
申请公布日期 |
2012.11.27 |
申请号 |
US20080151857 |
申请日期 |
2008.05.09 |
申请人 |
HUEMOELLER RONALD PATRICK;HINER DAVID JON;LIE RUSS;AMKOR TECHNOLOGY, INC. |
发明人 |
HUEMOELLER RONALD PATRICK;HINER DAVID JON;LIE RUSS |
分类号 |
H01K3/10;H01L21/48;H05K1/05;H05K3/00;H05K3/10;H05K3/12;H05K3/42;H05K7/10 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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