发明名称 CURABLE RESIN COMPOSITION, AND DRY FILM AND PRINTED WIRING BOARD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured film excellent in resolution and reflection characteristics, and a dry film and printed wiring board using the composition. <P>SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a titanium oxide, and (C) a filler obtained by burning a hydrated silicate mineral containing aluminum or magnesium. The curable resin composition preferably has a thermosetting component and contains a photopolymerization initiator and a photosensitive monomer. (C) the filler obtained by burning the hydrated silicate mineral containing aluminum or magnesium is preferably made of pyrogenic Neuburger silica particles. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012215718(A) 申请公布日期 2012.11.08
申请号 JP20110081296 申请日期 2011.03.31
申请人 TAIYO INK MFG LTD 发明人 ARIMA MASAO;YONEDA KAZUYOSHI;YOKOYAMA YUTAKA
分类号 G03F7/004;G03F7/038;H05K3/28 主分类号 G03F7/004
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