发明名称 Light Emitting Diode Package
摘要 A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier.
申请公布号 US2012273833(A1) 申请公布日期 2012.11.01
申请号 US201213545000 申请日期 2012.07.10
申请人 CHEN YI-WEN;EVERLIGHT ELECTRONICS CO., LTD. 发明人 CHEN YI-WEN
分类号 H01L33/52 主分类号 H01L33/52
代理机构 代理人
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