发明名称 HEAT RADIATOR
摘要 <P>PROBLEM TO BE SOLVED: To prevent a stress absorption space from being blocked by a surplus brazing material in a heat radiator which an insulation substrate and a heat sink are brazed through a stress relaxation material. <P>SOLUTION: In a heat radiator 1, a circuit layer 12 for mounting an electronic element is joined to one surface side of an insulation substrate 11, and a heat sink 13 is joined to the other side through a stress relaxation material 20. The stress relaxation material has at least one stress absorption space 21 which opens on at least one of an insulation substrate side surface and a heat sink side surface, and a recessed part 22, increasing a cross section area of the stress absorption space in a cross section cut on a surface intersecting a direction of laminating the insulation substrate, the stress relaxation material and the heat sink, is formed at an opening edge part of the stress absorption space. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012212767(A) 申请公布日期 2012.11.01
申请号 JP20110077343 申请日期 2011.03.31
申请人 SHOWA DENKO KK 发明人 MINAMI KAZUHIKO
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址