PROTECTIVE STRUCTURE OF SEMICONDUCTOR WAFER, METHOD FOR PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

摘要

Disclosed herein is a semiconductor wafer protection structure including a semiconductor wafer and a protective sheet overlaid on a circuit surface of the semiconductor wafer, wherein the protective sheet has a larger diameter than the outer diameter of the semiconductor wafer. The invention provides semiconductor wafer protection structures and methods, and laminated protective sheet for use therein that enable prevention of damage to a wafer during grinding and transportation when the wafer is ground to an ultrathin thickness and transported. Also provided is a process for processing a semiconductor wafer whereby damage to the wafer can be reduced during application and cutting of an adhesive sheet.