| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for semiconductor production process which exhibits excellent adhesive properties, water resistance, heat sealing properties, and good blocking resistance. SOLUTION: In the film for semiconductor production process having an easy-to-adhere layer provided on one side of a base film, a seal layer containing polyolefin resin which contains a (meta)acrylic ester component is formed on the other side of the base film. A film for semiconductor production process further provided with an adhesive resin layer on the upper surface of the easy-to-adhere layer is also provided. COPYRIGHT: (C)2010,JPO&INPIT |
