METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of easily realizing formation of a through electrode at a chip and connection between the through electrodes.

SOLUTION: A plurality of semiconductor substrates are prepared in which a through hole that penetrates between main surfaces is formed and the through hole is filled with a porous conductor. The plurality of semiconductor substrates are stacked with the porous conductors packed in the through hole being aligned. A conductor ink containing granular conductor is introduced into the porous conductor of the plurality of semiconductor substrates having been stacked. The plurality of stacked semiconductor substrates are baked.

COPYRIGHT: (C)2013,JPO&INPIT