METHOD AND APPARATUS FOR IMPROVED LASER SCRIBING OF OPTO-ELECTRIC DEVICES
摘要
Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pu lsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.
申请公布号
WO2012112342(A3)
申请公布日期
2012.10.18
申请号
WO2012US24181
申请日期
2012.02.07
申请人
ELECTRO SCIENTIFIC INDUSTRIES, INC.;CHACIN, JUAN;CHYR, IRVING;HALDERMAN, JONATHAN