| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip, a semiconductor package, and a method of manufacturing the semiconductor package that can prevent the occurrence of cracks and have high reliability. <P>SOLUTION: A semiconductor chip 1 has a plate shape, includes projection electrodes 2 on a circuit surface 3, and is provided with a bottom surface 4 having an area larger than the circuit surface 3 and side surfaces 5 connecting the circuit surface 3 and the bottom surface 4. The thickness D between the circuit surface 3 and the bottom surface 4 is 100 μm or less. The side surfaces 5 each have a vertical surface 6 formed in succession to the bottom surface 4 and an inclined surface 7 that is formed in succession to the vertical surface 6 and inclines toward the inside so as to continue to the circuit surface 3. When the height of the vertical surface is d, the value d/D is set to be larger than 0 and smaller than 1/2. The inclined surface 7 is formed to be a concave surface curved in concave shape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
