| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the consumption of a conductive particle containing liquid and improve the manufacturing efficiency when a through hole conductor part is formed in a through hole by the conductive particle containing liquid at a wiring circuit member. <P>SOLUTION: A wiring circuit member 1 includes: a base material 12; circuit part 4a and land parts 4b, 4d that serve as conductive patterns formed on an upper surface 12a and a lower surface 12b of the base material 12; and through hole conductive layers 3, each of which is composed of a through hole 13 penetrating through the base material 12 and a conductor, formed by applying a conductive particle containing liquid to the through hole 13 and solidifying the liquid, and electrically connects with the conductive patterns. In each through hole 13, wall surface grooves 13b are formed on a through hole wall surface 13a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
