发明名称 |
Method for forming metal pattern, metal pattern and printed wiring board |
摘要 |
The present invention provides a method for forming a metal pattern comprising a step of forming a polymer layer on a substrate; (a2) a step of applying a metal ion or the like to the polymer layer; (a3) a step of forming a conductive layer by reducing the metal ion or the like; (a4) a step of forming a patterned resist layer on the conductive layer; (a5) a step of forming a metal pattern by electroplating in the regions where the resist layer is not formed; (a6) a step of separating the resist layer; (a7) a step of removing the conductive layer from regions protected by the resist layer; and (a8) a step of performing a hydrophobilizing treatment.
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申请公布号 |
US8261438(B2) |
申请公布日期 |
2012.09.11 |
申请号 |
US20070297292 |
申请日期 |
2007.04.10 |
申请人 |
MATSUMOTO KAZUHIKO;FUJIFILM CORPORATION |
发明人 |
MATSUMOTO KAZUHIKO |
分类号 |
H05K3/02;H05K3/10 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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