| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit reduction of flatness of a cut surface in a semiconductor device in which a heat dissipation member is exposed by a cutting work or a grinding work on an external surface of a package. <P>SOLUTION: A semiconductor device 21 comprises: two pairs of a semiconductor chip 23 with a metal block body 28 in a package 22; a common heat sink 24 on an undersurface of the package 22; and heat sinks 25, 26 on a top face of the package 22. A recess 24a extending in a front-back direction is provided on an exposed surface of the heat sink 24. In manufacturing of the semiconductor device 21, the semiconductor chips 23, the metal block bodies 28, heat sinks 24, 25, 26 and the like are bonded and molded with an epoxy resin to form the package 22. Subsequently, the undersurface of the package 22 is cut to a cutting line to expose the heat sink 24. Because the heat sink 24 is segmented by the recess 24a, the heat sink 24 can be prevented from being deeply cut. <P>COPYRIGHT: (C)2012,JPO&INPIT |
