| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing tape integrated adhesive sheet and a semiconductor device using the same, which can inhibit separation of a ring frame and scattering of a chip in a dicing process and achieve excellent pickup property in a pickup process. <P>SOLUTION: A dicing tape integrated adhesive sheet 1 comprises a base material 10, a first adhesive layer 20 arranged on the base material, a second adhesive layer 30 arranged on the first adhesive layer and having an opening 30a exposing the first adhesive layer, and a die-bonding film 40 arranged so as to cover the opening. A semiconductor device uses the dicing tape integrated adhesive sheet. <P>COPYRIGHT: (C)2012,JPO&INPIT |
