| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an efficient evaluation method of deposition conditions in vacuum deposition, and to provide a deposition device therefor. <P>SOLUTION: While disposing a first shutter 10A so that the first region of the principal surface of a substrate 200 contained in a vacuum vessel 50 is exposed to a vapor deposition source 60 and the second region is shielded, a first thin film is deposited on the first region by first deposition conditions. Subsequently, while disposing a second shutter 10B so that at least a part of the second region of the principal surface of the substrate 200 is exposed to the vapor deposition source 60 and at least a part of the first region is shielded, a second thin film is deposited on the second region by second deposition conditions. Characteristics of the first and second thin films are evaluated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
