| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device which can more easily achieve downsizing. <P>SOLUTION: A semiconductor device A4 provided by the present invention comprises a plurality of terminals 41, 42, a first semiconductor chip 21, a second semiconductor chip 22 provided on the first semiconductor chip 21, and an encapsulation resin 1 covering the first semiconductor chip 21, the second semiconductor chip 22 and the plurality of terminals 41, 42. The plurality of terminals 41, 42 include the first terminal 41 connected with the first semiconductor chip 21 and the second terminal 42 connected with the second semiconductor chip 22. Bottom faces 41a, 42a in a thickness direction of the plurality of terminals 41, 42 are exposed on the encapsulation resin 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
