发明名称 PLASMA PROCESSING SYSTEMS INCLUDING SIDE COILS AND METHODS RELATED TO THE PLASMA PROCESSING SYSTEMS
摘要 A plasma processing system for generating plasma to process a wafer. The plasma processing system includes a set of top coils for initiating the plasma, a set of side coils for affecting distribution of the plasma, and a chamber structure for containing the plasma. The chamber structure includes a chamber wall and a dielectric member. The dielectric member includes a top, a vertical wall, and a flange. The top is connected through the vertical wall to the flange, and is connected through the vertical wall and the flange to the chamber wall. The set of top coils is disposed above the top. The set of side coils surrounds the vertical wall. A vertical inner surface of the vertical wall is configured to be exposed to the plasma. The inner diameter of the vertical wall is smaller than the inner diameter of the chamber wall.
申请公布号 WO2012115833(A1) 申请公布日期 2012.08.30
申请号 WO2012US25219 申请日期 2012.02.15
申请人 LAM RESEARCH CORPORATION;LONG, MAOLIN;PATERSON, ALEX 发明人 LONG, MAOLIN;PATERSON, ALEX
分类号 H01L21/306 主分类号 H01L21/306
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