| 摘要 |
<p>PURPOSE: A conductive bonding material and a conductor joining method are provided to remain components having a low melting point after a primary thermal treatment because the conductive bonding material contains metal components having three-stepped melting points. CONSTITUTION: A conductive bonding material(20) comprises metal particles(21) having a high melting point over a first melting point, metal particles(22) having a middle melting point, and metal particles(23) having a low melting point. The metal particles having the middle melting point have a second melting point which is over a first temperature and under a second temperature being lower than the first melting point. The metal particles having the low melting point have a third melting point under the first temperature. The high melting point is over 150°C, the middle melting point is within 80-139°C, and the low melting point is under 79°C.</p> |
