A CONNECT STRUCTURE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A manufacturing method of a connect structure and a manufacturing method of a semiconductor device using the same are provided to form a connection wire on a predetermined position by using a coupling structure. CONSTITUTION: A sacrificing layer(30) and an inter-layer insulating layer(20) are repeatedly laminated on a substrate. Sidewall blocking patterns(46a-46g) are formed on sidewalls of etch mask patterns. A first photo resist pattern, which selectively exposes a first sidewall blocking pattern on an edge, is formed. The sacrificing layer and the inter-layer insulating layer are etched by using the first photo resist pattern and the etch mask pattern. A second photoresist pattern is formed by eliminating a part of the first photo resist pattern and the etch mask pattern. A coupling structure is formed by etching the exposed sacrificing layer and the inter-layer insulating layer.