发明名称 |
HEAT TRANSFER ARRANGEMENT AND ELECTRONIC HOUSING COMPRISING A HEAT TRANSFER ARRANGEMENT |
摘要 |
<p>A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.</p> |
申请公布号 |
EP2478317(A1) |
申请公布日期 |
2012.07.25 |
申请号 |
EP20090849596 |
申请日期 |
2009.09.15 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
KAELLMARK, MAGNUS;HEDBERG, KLAS;JONSSON, FREDRIK |
分类号 |
F28D15/02;F28D15/06;G05D23/12;H01L23/427;H04B1/036;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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