发明名称 MOLD FOR MOLDING THERMOSETTING RESIN
摘要 <P>PROBLEM TO BE SOLVED: To suppress burrs due to resin leakage caused in molding of the thermosetting resin. <P>SOLUTION: When tightening the mold, molds 10 and 20 include a cavity part 30 and mold opening surfaces 12 and 22 at the periphery of the cavity part, and the periphery mold opening surface has a gap between both molds. Also the molds include first heaters 51 and 53 at the periphery of the cavity part and second heaters 52 and 54 at the periphery of a periphery mold opening surface, and includes insulated plates 55 and 56 at the mold side. A runner 31 includes a supplementary runner part 310. The supplementary runner part 310 is made wider than the gap G of the mold opening surface, and narrower than the thickness of the runner, and molding of the thermosetting resin is carried out to fix the supplementary runner part 310 as a burr occurrence part. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012131178(A) 申请公布日期 2012.07.12
申请号 JP20100286784 申请日期 2010.12.23
申请人 STANLEY ELECTRIC CO LTD 发明人 KOBAYASHI HAJIME;OKABE HITOSHI;MANO EIJI
分类号 B29C45/27;B29C45/34;B29K101/10 主分类号 B29C45/27
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