| 摘要 |
<p>In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste (120) obtained by mixing a fiber piece (108a-d) is recovered to obtain a recovery paste; filtration is carried out through a filter (121); a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste (122) is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.</p> |
