发明名称 |
Apparatus with strain release feature for high temperature processes |
摘要 |
A method and apparatus for thermally treating a substrate is provided. A thermal treatment chamber has a substrate support and a magnetically permeable rotor housed in a rotor well. An annular cover shields the rotor from the processing environment. The annular cover has a thermal stress relief joint formed therein that provides one or more mechanical degrees of freedom to allow portions of the cover to shift with thermal stresses. In one embodiment, a gap is formed in the annular cover at the point of maximum thermal stress. |
申请公布号 |
US8217317(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US20080207766 |
申请日期 |
2008.09.10 |
申请人 |
TSENG MICHAEL;APPLIED MATERIALS, INC. |
发明人 |
TSENG MICHAEL |
分类号 |
H05B3/68;F26B19/00 |
主分类号 |
H05B3/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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