发明名称 Apparatus with strain release feature for high temperature processes
摘要 A method and apparatus for thermally treating a substrate is provided. A thermal treatment chamber has a substrate support and a magnetically permeable rotor housed in a rotor well. An annular cover shields the rotor from the processing environment. The annular cover has a thermal stress relief joint formed therein that provides one or more mechanical degrees of freedom to allow portions of the cover to shift with thermal stresses. In one embodiment, a gap is formed in the annular cover at the point of maximum thermal stress.
申请公布号 US8217317(B2) 申请公布日期 2012.07.10
申请号 US20080207766 申请日期 2008.09.10
申请人 TSENG MICHAEL;APPLIED MATERIALS, INC. 发明人 TSENG MICHAEL
分类号 H05B3/68;F26B19/00 主分类号 H05B3/68
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