OVERHEAD-MOUNTED HEATSINK

摘要

An apparatus includes a supporting member, a cooling stage and a translating member. The cooling stage has a surface for contacting an electronic device. The cooling stage is translatably coupled to the supporting member. The translating member is coupled to the supporting member and attached to the cooling stage. The translating member is operable to translate the cooling stage relative to the supporting member to urge the cooling stage surface against the electronic device.