摘要 |
When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size. |