| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor element sealing body and a manufacturing method of a semiconductor package which simultaneously manufacture multiple packages, each of which includes a semiconductor element and secures electrical connection between an upper part and a lower part, and manufacture the packages with high reliability. <P>SOLUTION: A manufacturing method of a semiconductor element sealing body of this invention is a method for manufacturing a semiconductor element sealing body 270 having semiconductor elements 26, conductor pillars 28, and a sealing part 27 sealing the semiconductor elements 26 and the conductor pillars 28. The manufacturing method includes: a semiconductor element placement process in which the semiconductor elements 26 are placed on a dummy substrate 101 and a sacrificial layer 38 is formed; a sealing part formation process in which a sealing part is formed so as to cover the dummy substrate 101, the semiconductor elements 26, and the sacrificial layer 38; a removal process in which the dummy substrate 101 is removed; and a conductor pillar formation process in which the sacrificial layer 38 is removed by heating to form through holes 271, and then the conductive pillars 28 are formed in the through holes 271 to obtain the semiconductor element sealing body 270. <P>COPYRIGHT: (C)2012,JPO&INPIT |
