摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alumina substrate which enhances efficiency of various kinds of devices to be packaged on a substrate surface by enhancing the heat radiation characteristic of a circuit substrate having intricate shapes. <P>SOLUTION: The alumina substrate is obtained by molding/sintering a material for molding containing an alumina powder composition composed of 20 to 40 mass% first alumina powder of 0.3 to 0.7 μm in central grain size and 60 to 80 mass% second alumina powder of 1.5 to 2.8 μm in central grain size. <P>COPYRIGHT: (C)2007,JPO&INPIT |