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发明名称
LEAD-FREE SOLDER BALL
摘要
申请公布号
PT1679149(E)
申请公布日期
2012.07.02
申请号
PT20040792080T
申请日期
2004.10.06
申请人
SENJU METAL INDUSTRY CO., LTD.
发明人
DAISUKE SOUMA;TAKAHIRO ROPPONGI;HIROSHI OKADA;HIROMI KAWAMATA
分类号
B23K35/26;C22C13/00;H05K3/34
主分类号
B23K35/26
代理机构
代理人
主权项
地址
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