发明名称 PHOSPHORUS-FREE ELECTROLESS NICKEL PLATING SOLUTION AND NICKLE-ALLOY PLATING SOLUTION AND ELECTROLESS PLATING METHOD USING THE SAME
摘要 PURPOSE: A phosphorus-free electroless nickel plating solution and an electroless plating method using the same are provided to reduce the costs for wastewater treatment by not using hypophosphorous acid soda as reductant. CONSTITUTION: A phosphorus-free electroless nickel plating solution comprises nickel salt, dimethylamine borane and boric acid as reducing agent, ammonium acetic acid as complexing agent, and sodium citrate as stabilizer. The nickel salt comprises nickel sulfate of 20-35g/l and nickel sulfate ammonium of 0.1-5g/l to nickel plating solution of 1 liter. The reducing agent comprises dimethylamine borane of 3-10g/l and boric acid of 20-30g/l to nickel plating solution of 1 liter. The complexing agent comprises ammonium acetic acid 5-15g/l to nickel plating solution of 1 liter. The stabilizer comprises sodium citrate of 10-20g/l to nickel plating solution of 1 liter.
申请公布号 KR20120066303(A) 申请公布日期 2012.06.22
申请号 KR20100127569 申请日期 2010.12.14
申请人 SUNG, YUL SUP 发明人 SUNG, YUL SUP
分类号 C23C18/34;C23C18/30 主分类号 C23C18/34
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