METHOD FOR DIVIDING BONDED SUBSTRATE

摘要

PURPOSE: A dividing method of a bonded substrate is provided to reduce number of break processes and exclude substrate reverse process, thereby simplifying the process. CONSTITUTION: A dividing method of a bonded substrate comprises the following steps: full-cut scribing with a second cutter wheel along a first direction of a second substrate(G2); scribing by a first wheel along the first direction of a first substrate(G1); brake processing along the first direction of the first substrate in order to form a plurality of shift book shaped substrates; full-cut scribing with the second cutter wheel along a second direction of the second substrate; scribing by the first cutter wheel along the second direction of the first substrate; and brake processing along the second direction of the first substrate in order to divide each unit board.