发明名称 |
CAMERA MODULE AND METHOD FOR FABRICATING THE SAME |
摘要 |
The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer. |
申请公布号 |
US2012155854(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US20100974720 |
申请日期 |
2010.12.21 |
申请人 |
HUANG TZU-WEI;CHEN WEI-PING;CHANG JUI-HUNG;HUANG CHIA-HUI;CHEN TENG-SHENG |
发明人 |
HUANG TZU-WEI;CHEN WEI-PING;CHANG JUI-HUNG;HUANG CHIA-HUI;CHEN TENG-SHENG |
分类号 |
G03B17/02;H05K13/00 |
主分类号 |
G03B17/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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