发明名称 CAMERA MODULE AND METHOD FOR FABRICATING THE SAME
摘要 The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
申请公布号 US2012155854(A1) 申请公布日期 2012.06.21
申请号 US20100974720 申请日期 2010.12.21
申请人 HUANG TZU-WEI;CHEN WEI-PING;CHANG JUI-HUNG;HUANG CHIA-HUI;CHEN TENG-SHENG 发明人 HUANG TZU-WEI;CHEN WEI-PING;CHANG JUI-HUNG;HUANG CHIA-HUI;CHEN TENG-SHENG
分类号 G03B17/02;H05K13/00 主分类号 G03B17/02
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