| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide copper foil for a printed circuit board improved in adhesion and moisture resistance, and the printed circuit board. <P>SOLUTION: The copper foil 1 for the printed circuit board is formed with a Cu-Sn-Ni layer 20 on a surface bonded to at least a base material of a copper foil material 10, and a Cr layer 30 formed on the Cu-Sn-Ni layer 20. The Cu-Sn-Ni layer and the Cr layer contain 0-25 wt.% Sn, 0-20 wt.% Ni and 0-15 wt.% Cr. The printed circuit board is manufactured by forming a desired wiring pattern on a copper foil surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
