| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily prepare a drop recipe. <P>SOLUTION: This method includes a test drop recipe preparation step for preparing a plurality of testing drop recipes based on design data of a semiconductor integrated circuit, a selection step for selecting the drop recipe with a smallest number of defects for every imprinting position on a processed substrate from the plural testing drop recipes based on results of defect tests of patterns of a hardening resin material formed by imprinting a template, on which a pattern of the semiconductor integrated circuit is formed, on the hardening resin material applied to a processed substrate using the testing drop recipe, and a database step for creating a drop recipe preparation assist database by collecting the drop recipe for every selected imprinting position in every functional circuit block constituting the semiconductor integrated circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
