PURPOSE: An adhesive film for a semiconductor device is provided to minimize static electricity generated in the stripping of a dicing adhesive by performing an antistatic process on at least one side of a protection film of a die bonding adhesive. CONSTITUTION: A dicing adhesive(4) is formed on a base film(5). A supporter is formed on the dicing adhesive. A die bonding adhesive(2) is formed on the supporter. An adhesive protection film(1) is formed on the die bonding adhesive. An external diameter of the die bonding adhesive is smaller than that of the dicing adhesive.
