发明名称 Thermosensitive adhesive material
摘要 <p>A thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the thermosensitive adhesive material includes a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of -70°C to -30°C.</p>
申请公布号 EP2014688(B1) 申请公布日期 2012.05.30
申请号 EP20080159903 申请日期 2008.07.08
申请人 RICOH COMPANY, LTD. 发明人 SHIMBO, HITOSHI;YAMAGUCHI, TAKEHITO;KUGA, YUTAKA;MORITA, MITSUNOBU;SASAKI, TAKAYUKI
分类号 C08F220/44;B32B27/30;B41M5/44;B41M5/50;B44C1/10;C08L9/02;C09J109/02;G09F3/02;G09F3/10 主分类号 C08F220/44
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