发明名称 |
Thermosensitive adhesive material |
摘要 |
<p>A thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the thermosensitive adhesive material includes a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of -70°C to -30°C.</p> |
申请公布号 |
EP2014688(B1) |
申请公布日期 |
2012.05.30 |
申请号 |
EP20080159903 |
申请日期 |
2008.07.08 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
SHIMBO, HITOSHI;YAMAGUCHI, TAKEHITO;KUGA, YUTAKA;MORITA, MITSUNOBU;SASAKI, TAKAYUKI |
分类号 |
C08F220/44;B32B27/30;B41M5/44;B41M5/50;B44C1/10;C08L9/02;C09J109/02;G09F3/02;G09F3/10 |
主分类号 |
C08F220/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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