| 摘要 |
PURPOSE: A bonding material application apparatus is provided to eliminate a detector because a residual amount of solder paste is calculated by a detection value of an encoder so that an increase of the number of components is controlled. CONSTITUTION: A bonding material application apparatus comprises a receiving container(110), an extrusion unit, a motor(723), a position detection unit, a motor controlling member, an application member(711), and a residual amount calculating unit. The extrusion unit extrudes bonding materials contained in a receiving container through a supply hole. The motor relatively transfers the extrusion unit and receiving container. The position detection unit detects a driving position of the motor responding to a relative position of the receiving container and extrusion unit. The motor controlling member controls a supply of the bonding materials by controlling the driving of the motor based on the detected driving position of the motor. The application member spreads the bonding materials supplied from the receiving container on a substrate. The residual amount calculating unit calculates information of the residual amount of the bonding materials based on information related to the relative positions of the receiving container and the extrusion unit, and the driving position of the motor and a current position of the motor detected at a current relative position of the receiving container and extrusion unit. |
