| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure which is free from the risk of short-circuiting between wiring and is capable of obtaining high reliability in connection of wiring between a flexible substrate and a rigid substrate even when a pitch of the wiring is narrowed. <P>SOLUTION: A connection structure 1 comprises: a flexible substrate 3 provided with a first wiring 2; a rigid substrate 5 provided with a second wiring 4 on a rigid board 5a; and a first resin layer 6 that fixedly connects between the flexible substrate 3 and the rigid substrate 5 in a state in which the first wiring 2 and the second wiring 4 are connected with each other. The rigid substrate 5 incudes a second resin layer 7 between the rigid board 5a and the second wiring 4. The second wiring 4 is deformed by the connection with the first wiring 2, and the second resin layer 7 is also elastically deformed to follow the deformation of the second wiring 4. The deformation state of the second wiring 4 and the elastic deformation state of the second resin layer 7 are retained by the first resin layer 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
