发明名称 |
LIGHT EMITTING DIODE COMPONENTS INTEGRATED WITH THERMOELECTRIC DEVICES |
摘要 |
The present disclosure relates to structures of LED components that integrate thermoelectric devices with LEDs on LED emitter substrates for cooling the LEDs. The present disclosure also related to methods for integrating LED dies with thermoelectric elements. The LED component includes an LED emitter substrate with a cavity in a downward facing surface of the LED emitter substrate and thermal vias that extend from a bottom of the cavity to an area close to an upward facing surface of the LED emitter substrate. The device also includes thermoelectric elements disposed in the cavity where the thermoelectric elements connect with their corresponding thermal vias. The device further includes a thermoelectric substrate in the cavity to electrically connect to the thermoelectric elements. The device further includes an LED die on the upward facing surface of the LED emitter substrate such that the LED die is opposite the cavity.
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申请公布号 |
US2012119246(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US20100946453 |
申请日期 |
2010.11.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHIH-KUANG;HSIA HSING-KUO |
分类号 |
H01L33/20;H01L21/329 |
主分类号 |
H01L33/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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