发明名称 Method of fabricating a piezoelectric vibrating piece
摘要 To carry out frequency adjustment easily, accurately and efficiently and achieve low cost formation and promotion of maintenance performance without being influenced by a size of a piezoelectric vibrating piece, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating pieces having a piezoelectric plate 11, a pair of exciting electrodes 12, 13, and a pair of mount electrodes electrodes 15, 16 by utilizing a wafer S, the method including an outer shape forming step of forming a frame portion S1 at the wafer and forming a plurality of piezoelectric plates to be connected to the frame portion by way of a connecting portion 11a, an electrode forming step of respectively forming pairs of exciting electrodes and pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes S2, S3 to be respectively electrically connected to the pairs of mount electrodes by way of the connecting portion, a frequency adjusting step of adjusting a frequency of the piezoelectric plate while applying a drive voltage between the pair of the extended electrodes, and a cutting step of fragmenting the plurality of piezoelectric plates.
申请公布号 US8176606(B2) 申请公布日期 2012.05.15
申请号 US20090360424 申请日期 2009.01.27
申请人 KOBAYASHI TAKASHI;SEIKO INSTRUMENTS INC. 发明人 KOBAYASHI TAKASHI
分类号 H04R17/10;H01L41/047 主分类号 H04R17/10
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