| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminate type ceramic electronic component in which the conductive paste used to form side electrodes is not easily peeled off during a fabrication process. <P>SOLUTION: Regarding an unsintered ceramic layer composed of at least one layer, (i) in a portion constituting an individual substrate, there are formed a plurality of first through holes 22 in rows spaced to and from a border line 29 in a portion constituting an individual substrate, (ii) the first through holes 22 are filled with conductive paste 24, (iii) a second through hole 28 partly overlapping the first through holes 22 and also reaching the border line 29 is formed, and (iv) the second through hole 28 is filled with a burning-out material 27. A via hole conductor which has had the conductive paste 24 sintered after unsintered ceramic layers were laminated and then calcined is exposed to a space formed as a result of the burning-out material 27 being destroyed by burning. The exposed via hole conductor is plated to form a side electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
