PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to shorten process time for forming a bump by forming the bump by using a screen printing method and to solve a bending phenomenon of the printed circuit board. CONSTITUTION: A bump is printed on one side of a metal layer. An insulating layer(130) is laminated on one side of the metal layer to be penetrated into the bump. A flat surface is formed by coining the bump which is exposed from the insulating layer. A circuit layer(115) is formed by pattering the metal layer. A first solder resist(140) is formed in the circuit layer. A first opening part is formed in the first solder resist in order to expose a pad part of the circuit layer. A second solder resist(150) is formed in the insulating layer. A second opening part is formed in the second solder resist in order to expose the bump part.