Method for fabricating metal layer using by double electroplating and metal layer fabricated by the same

摘要

PURPOSE: An electroplating method using a double electroplating method and a metal thin film formed using the same are provided to control the concentration of organic additive added to form metal. CONSTITUTION: An electroplating method of a metal thin film using a double electroplating method is as follows. A metal thin film is first electroplated using low-concentration accelerator. The metal thin film is second electroplated using high-concentration accelerator. The accelerator is an organic compound with less than 500g/mol molecular weight.