发明名称 |
Low profile ball grid array (BGA) package with exposed die and method of making same |
摘要 |
Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate having a central opening. An IC die, resides within the opening in the substrate. Wirebonds couples a plurality of bond pads on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material encapsulates at least the IC die and the wirebonds such that at least a bottom surface of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate.
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申请公布号 |
US8169067(B2) |
申请公布日期 |
2012.05.01 |
申请号 |
US20060583719 |
申请日期 |
2006.10.20 |
申请人 |
LAW EDWARD;ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN;BROADCOM CORPORATION |
发明人 |
LAW EDWARD;ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN |
分类号 |
H01L23/48;H01L23/06;H01L23/22;H01L23/24 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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