| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a work processing method, capable of sufficiently removing cutting dust of an adhesive layer composed of ultraviolet curing glue attached to the surface of a work. <P>SOLUTION: A work 1 is held on a frame 5 by the adhesion of the rear face 1b of the work 1 to an adhesive layer 6b composed of the ultraviolet curing glue of a dicing tape 6 adhered to the frame 5. In this state, the work 1 is divided into semiconductor chips by being cut by a cutting blade 13 from the surface 1a of the work 1 to the middle of the dicing tape 6. Subsequently, after the irradiation of the surface 1a of the work 1, having attached cutting dust S produced by cutting, with ultraviolet ray U, so as to reduce adhesive strength of the cutting dust S composed of the adhesive layer 6b, the cutting dust S is cleaned and removed by the ejection of washing water W onto the surface 1a of the work 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
