Strip Mounted Semiconductor Device

摘要

1,181,336. Semi-conductor devices. GENERAL MOTORS CORP. 13 Sept., 1968 [29 Nov., 1967], No. 43613/68. Heading H1K. The invention relates to the provision of electrodes for and the encapsulation of semiconductor devices. In the embodiment shown each transistor die 46 is bonded via its collector to a once flat strip 10 of ductile metal. The strip is given rigidity in the mounting area by canted portions 34, 36. The emitter and base of the transistor are bonded by flexible wires 42, 44 to terminal strips 121, 141 bent up from the strip. The transistor die (and perhaps the flexible wires) is given a first organic coating and is then encapsulated by transfer moulding or casting. The encapsulant 52 is kept from the lower face of the metal strip so that in use the collector may be directly bolted to a heat sink. During bonding, the encapsulant flows under the canted edges 34, 36 and under raised portions 48, 50 at the middle of the strip and when hardened is thus keyed to the strip. The terminal strips 121, 141 are provided with enlarged ends 30, 32 to key them into the encapsulant. Each transistor is then severed from the strip by cutting out portion 54; the strips 121, 141 may be straightened. The strips may mount, for example, 6-8 transistors which are processed simultaneously; single transistors would be made from a short metal blank, or transistors could be made sequentially on a very long strip. If a diode is to be mounted a strip may be produced with only one of the leads 121, 141 or with both if the main strip serves only as a mount for a planar diode. Up to five electrodes (four of them forming pairs otherwise like 121, 141) may be used with, for example, a thyristor.