发明名称 METHOD FOR MANUFACTURING FLEXIBLE WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a simple manufacturing method which improves reliability of a side electrode of a flexible wiring board having an insulator layer formed of a liquid crystal polymer. <P>SOLUTION: A method for manufacturing a flexible wiring board comprises the steps of: forming a double-sided wiring raw board in which a first conductive metal layer and a second conductive metal layer are electrically connected by a conductive bump penetrating the insulator layer; forming a through-groove which penetrates the double-sided wiring raw board in a thickness direction, so as to expose at least a part of the conductive bump; and forming the side electrode on at least the conductive bump exposed on an inner wall surface of the through-groove, by plating. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012080050(A) 申请公布日期 2012.04.19
申请号 JP20100235893 申请日期 2010.10.04
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 NAKAO SATOSHI;SEKINE NORIAKI;YAMAGUCHI YUKIO
分类号 H05K3/40;H05K1/02 主分类号 H05K3/40
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