发明名称 |
Method for manufacturing integrated circuit package system with under paddle leadfingers |
摘要 |
A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
|
申请公布号 |
US8153478(B2) |
申请公布日期 |
2012.04.10 |
申请号 |
US201113172560 |
申请日期 |
2011.06.29 |
申请人 |
BADAKERE GOVINDAIAH GURUPRASAD;TRASPORTO ARNEL;STATS CHIPPAC LTD. |
发明人 |
BADAKERE GOVINDAIAH GURUPRASAD;TRASPORTO ARNEL |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|