| 摘要 |
<p>The LED (1) has a primary optics (12), and an LED chip (3) arranged and electrically contacted on a ceramic substrate (2) by die and wire bonds. The substrate is manufactured from multiple laminated green layers (4). The LED chip is integrated in one of the green layers. A reflector like opening is provided in the substrate. The green layers are configured with electrical terminals (7, 8) for arranging and electrically contacting the LED chip, electrical terminal surfaces (10, 11) for surface mounting, and electronic components (15) e.g. protective diodes. The electronic components are capacitors, coils and electrical resistors.</p> |
