发明名称 SEMICONDUCTOR LAMINATE, HFET INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To reduce a leakage current and improve a withstand voltage of an HFET which includes a semiconductor laminate without turning a compound semiconductor layer beneath a channel layer included therein into a p type by performing impurity doping. <P>SOLUTION: The semiconductor laminate includes at least first, second and third compound semiconductor layers (13, 14, and 15) sequentially deposited on a substrate (11), where at least a partial layer (16) of the first compound semiconductor layer (13) is modified to an amorphous substance, and the second compound semiconductor layer (14) has a smaller band gap than that of the first compound semiconductor layer (13), making it capable of acting as a light absorption layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012064758(A) 申请公布日期 2012.03.29
申请号 JP20100207866 申请日期 2010.09.16
申请人 SHARP CORP 发明人 ITO NOBUYUKI
分类号 H01L21/338;H01L21/20;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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