| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has high water-resistant adhesiveness to a substrate after heat curing, is free of problems such as deposition and forms an excellent cured relief pattern, by using a silicon-based coupling agent showing high adhesive quality to the substrate as an additive component of a heat-resistant photosensitive resin composition, and to provide a method for producing the cured relief pattern using the composition and a semiconductor device having the cured relief pattern. <P>SOLUTION: A photosensitive resin composition comprises, for (A) 100 pts.mass of a polymer which is an alkali-soluble phenolic resin, a polyhydroxystyrene or a derivative of the polyhydroxystyrene: (B) 1-100 pts.mass of a photosensitive diazonaphthoquinone compound; (C) 100-1,000 pts.mass of an organic solvent; and (D) 0.1-20 pts.mass of an auxiliary adhesive which is an organic compound containing an alkoxysilyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
